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 MITSUBISHI SEMICONDUCTOR TRIAC
BCR3KM-14
LOW POWER USE INSULATED TYPE, PLANAR PASSIVATION TYPE
BCR3KM-14
OUTLINE DRAWING
10 0.3
6.5 0.3 3 0.3
Dimensions in mm
2.8 0.2
15 0.3
3.2 0.2
14 0.5
3.6 0.3
1.1 0.2 1.1 0.2 0.75 0.15
E
0.75 0.15
2.54 0.25
2.54 0.25
4.5 0.2
2.6 0.2
V Measurement point of case temperature
.................................................................. 3A q VDRM ................................................................. 700V q IFGT !, IRGT ! , IRGT # ..................................... 30mA q Viso .................................................................. 2000V
q IT (RMS)
T1 TERMINAL T2 TERMINAL GATE TERMINAL
TO-220FN
APPLICATION Contactless AC switches, light dimmer, electric blankets, control of household equipment such as electric fan, solenoid drivers, small motor control, other general purpose control applications
MAXIMUM RATINGS
Symbol VDRM VDSM Parameter Repetitive peak off-state voltageV1 Voltage class 14 700 840 Unit V V
Non-repetitive peak off-state voltageV1
Symbol IT (RMS) ITSM I 2t PGM PG (AV) VGM IGM Tj Tstg -- Viso
Parameter RMS on-state current Surge on-state current I 2t for fusing Peak gate power dissipation Average gate power dissipation Peak gate voltage Peak gate current Junction temperature Storage temperature Weight Isolation voltage Typical value
Conditions Commercial frequency, sine full wave 360 conduction, Tc=108C 60Hz sinewave 1 full cycle, peak value, non-repetitive Value corresponding to 1 cycle of half wave 60Hz, surge on-state current
Ratings 3 30 3.7 3 0.3 6 0.5 -40 ~ +125 -40 ~ +125 2.0 2000
Unit A A A2s W W V A C C g V
Feb.1999
Ta=25C, AC 1 minute, T1 * T2 * G terminal to case
V1. Gate open.
MITSUBISHI SEMICONDUCTOR TRIAC
BCR3KM-14
LOW POWER USE INSULATED TYPE, PLANAR PASSIVATION TYPE
ELECTRICAL CHARACTERISTICS
Symbol IDRM VTM VFGT ! VRGT ! VRGT # IFGT ! IRGT ! IRGT # VGD Rth (j-c) (dv/dt)c Parameter Repetitive peak off-state current On-state voltage
!
Test conditions Tj=125C, VDRM applied Tc=25C, ITM=4.5A, Instantaneous measurement
@ # !
Limits Min. -- -- -- -- -- -- -- -- 0.2 --
V2
Typ. -- -- -- -- -- -- -- -- -- -- --
Max. 2.0 1.6 1.5 1.5 1.5 30 30 30 -- 4.0 --
Unit mA V V V V mA mA mA V C/ W V/s
Gate trigger voltage
Tj=25C, VD=6V, RL=6, RG=330
Gate trigger current Gate non-trigger voltage Thermal resistance Critical-rate of rise of off-state commutating voltage
@ #
Tj=25C, VD=6V, RL=6, RG=330 Tj=125C, VD=1/2VDRM Junction to case V3
V2. The critical-rate of rise of the off-state commutating voltage is shown in the table below. V3. The contact thermal resistance Rth (c-f) in case of greasing is 0.5C/W.
Voltage class
VDRM (V)
(dv/dt)c Symbol R Min. -- V/s L 5 Unit
Test conditions 1. Junction temperature Tj=125C 2. Rate of decay of on-state commutating current (di/dt)c=-1.5A/ms 3. Peak off-state voltage VD=400V
Commutating voltage and current waveforms (inductive load)
SUPPLY VOLTAGE (di/dt)c TIME TIME VD TIME
14
700
MAIN CURRENT MAIN VOLTAGE (dv/dt)c
PERFORMANCE CURVES
MAXIMUM ON-STATE CHARACTERISTICS RATED SURGE ON-STATE CURRENT 40
SURGE ON-STATE CURRENT (A)
ON-STATE CURRENT (A)
102 7 5 3 2 101 7 5 3 2 100 7 5 3 2
TC = 25C
35 30 25 20 15 10 5 0 100 2 3 4 5 7 101 2 3 4 5 7 102
10-1 0.6 1.0 1.4 1.8 2.2 2.6 3.0 3.4 3.8 ON-STATE VOLTAGE (V)
CONDUCTION TIME (CYCLES AT 60Hz)
Feb.1999


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